Application of Laser Lift-off Technique in Flexible Electronics Manufacturing

JI Lingfei1,2 MA Rui1,2 ZHANG Ximin1,2 SUN Zhengyang1,2 LI Xin1,2

(1.Institute of Laser Engineering, Beijing University of Technology, Beijing, China 100124)
(2.Key Laboratory of Trans-Scale Laser Manufacturing Technology, Ministry of Education, Beijing, China 100124)

【Abstract】Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in the case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.

【Keywords】 laser technique; laser material processing; laser lift-off; flexible electronics; ultrafast laser;

【DOI】

【Funds】 National Key Basic Research Program of China (2018YFB1107500) National Natural Science Foundation of China (519770517, 51575013)

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This Article

ISSN:0258-7025

CN: 31-1339/TN

Vol 47, No. 01, Pages 9-18

January 2020

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Article Outline

Abstract

  • I Introduction
  • 2 Application research progress
  • 3 New methods of LLO
  • 4 Conclusions
  • References